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Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding

Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd
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    Buy cheap Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding from wholesalers
     
    Buy cheap Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding from wholesalers
    • Buy cheap Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding from wholesalers
    • Buy cheap Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding from wholesalers
    • Buy cheap Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding from wholesalers
    • Buy cheap Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding from wholesalers

    Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding

    Ask Lasest Price
    Brand Name : Sanxin
    Model Number : SX1255
    Certification : ISO 9001
    Payment Terms : L/C,T/T,Western Union
    Delivery Time : 5-25days
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    Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding

    Micron-level soldering expert: Carbide laser solder ball nozzle


    Introduction:
    200-1500μm full range coverage —zero hole blocking·coaxiality ±0.002

    It breaks through the bottlenecks of hole blocking and solder sticking of traditional nozzles, and realizes tens of millions of burr-free and splash-free precise solder ball injection in the field of microelectronics packaging.


    Specification:

    Solder ball size (μm)Inner diameter (mm)Tolerance standardApplicable scenarios
    200-250Φ0.09-0.12±0.001mmIC wafer/acoustic device micro solder joint
    300-350Φ0.34±0.003±0.003mmMobile phone camera/data cable solder joint
    450-600Φ0.55-0.65±0.004mmAutomotive radar/FPC soft board
    750-900Φ0.85-0.95±0.005mmPower module/relay (main model)
    1000-1500Φ1.02-1.50±0.008mmHigh power PCB ground pad

    PS. : The size is for reference only, customization is supported


    Application:


    Consumer electronics
    Mobile phone camera module: 0.15mm solder joint spacing CCM welding (350μm solder ball nozzle)
    Type-C interface terminal: multi-level countersunk hole precision welding (aperture tolerance ±0.003mm)
    TFT/FPC flexible screen: non-contact welding in temperature sensitive areas (avoid electrostatic damage)


    High-end electronics and semiconductors
    Reversing radar sensor: anti-vibration welding (600μm nozzle for 1.0mm pad)
    IC wafer packaging: φ0.09μm micro-hole solder ball precise positioning (coaxiality ≤0.005)
    Optical module fiber coupling: spatter-free welding (inert gas protection process)


    Industrial core components
    Automobile key chip: micro solder joint oxidation resistance (400μm nozzle)
    Fuse ceramic tube: stable spraying in high temperature environment (temperature resistance >850℃)

    Quality Micron-level Soldering Tungsten Carbide Nozzle with ±0.005mm Tolerance and Coaxiality ±0.002 for Precision Laser Welding for sale
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